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Water-free manufacturing approach could help advance 2D electronics integration

The future of technology has an age-old problem: rust. When iron-containing metal reacts with oxygen and moisture, the resulting corrosion greatly impedes the longevity and use of parts in the automotive industry.

While it's not called "rust" in the semiconductor industry, oxidation is especially problematic in two-dimensional (2D) semiconductor materials, which control the flow of electricity in electronic devices, because any corrosion can render the atomic-thin material useless.

Now, a team of academic and enterprise researchers has developed a synthesis process to produce a "rust-resistant" coating with additional properties ideal for creating faster, more durable electronics.

The team, co-led by researchers at Penn State, published their work in Nature Communications.

2D materials are ultra-thin, just one or a few atoms thick. They hold promise for advanced semiconductors because their thinness provides a shorter and more direct path for electrons to move quickly and with less resistance through the material. This in turn allows for faster and more efficient electronic performance.

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