A research team has unveiled an innovative technology for ultraprecision surface polishing and cleaning using simultaneously operating magnetic micro spinbots. These tiny robots, capable of nanometer-scale contaminant removal and polishing, offer a lightweight, scalable, and cost-effective alternative for advanced industries like semiconductors and optics.

The team's findings have been published in the journal Small Structures, where they highlight the potential of magnetic soft robots to revolutionize precision manufacturing. The researchers were led by Professor Sanha Kim from the Korea Advanced Institute of Science and Technology (KAIST) and Professor Jeong Jae (JJ) Wie from the Hanyang University.

In the production of high-density semiconductors, achieving ultra-low surface roughness on metal layers is crucial for device performance. Even minor imperfections can lead to defects that degrade the efficiency and reliability of electronic components.

Traditional methods, such as chemical–mechanical planarization (CMP) and post-CMP cleaning systems, have been the industry standard for surface planarization and contaminant removal. However, these systems come with significant drawbacks. CMP equipment is not only large and complex but also extremely expensive, making it difficult to scale or upgrade.

• Read More